Welcome Lukas Henkel of OV Tech GmbH, a product design firm based in Nuremburg Germany!

Miniturization and the limits of miniturization
Price is a constraint
Using standard PCB tech (off the shelf)
Open source SIP
Steps
- Conventional pcbs / components
- Silicon inductors embedded in boards
- Bonded Bare dies / stacked
Need volume to make it work
Requirements to fit into ______
iMX8 ULP – 0.4mm CSP
SIP Footprint
Module abstraction layer talk
Framework laptop
Software support / BSP
SIP will be different than PiMX8
Crowdsupply campaign launching 2-3 weeks and delivery in Dec/Jan
OpenSource laptop
CM4 vs PiMX8
SPI Flash with backup partition
Secure element SE050
Footprint for coral tpu and Halo 8
Trying to solve the problem of vision use cases
Marketing using layout / products but also making money on it
Katerina show
Visualizing simulations
Developing intuition
OpenEMS
Usability is based on python scripting
Using Blender for heat map
BVTKNodes uses .vtk file output
Multiphysics solvers
Things that drive Lukas
For HDI, Thinking in 3D / 2.5D and being able to visualize
Layers ranging from 4 to 18
Any layer design for SIP
Wurth electroncis for high density “any layer stackup”
Article series on altium for the open laptop
Follow Lukas on LinkedIn

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